Ei PCB Factory WELCOME
 Board Types: Multilayer, SS & DS with or without PTH Base Material: FR3, FR4,CEM1, CEM3 and matherials for high temperature like poliamid etc Copper Thickness: 17.5 um, 35 um, 70 um, 105 um Number of layers:	1,2,4,6,8-24 max Board Thickness: 	0.2-3.2 mm PTH diameter: 	0.2 mm min Board Thickness: 	0.2-3.2 mm
 
Technology Indexes
Manufacturing capability Items Parameter Special technics
Mechanical 1 Material FR4, CEM-3, CEM-1 Aluminum, High Tg FR4
2 Layers 1, 2, 4, 6, 8, 10 12, 20
3 Max board size 620 x 450mm  
4 Board thickness 0.4-3.2mm  
5 Min plated hole size 0.25±0.075mm  
6 Min unplated hole size 0.2±0.075mm  
Artwork 1 Min conductor width 0.1mm/4mil  
2 Min conductor spacing 0.1mm/4mil  
3 Min pad size (PTH) 0.1mm/4mil  
4 Hole cooper thickness ≥20um  
5 Profile Routing, V-CUT, Chamfer  
6 Chamfer Angle 30, 45, 60  
7 Warp & Wrist ≤0.7% ≤0.45%
Soldering mask 1 Available colors Green, Red, Blue, White, Black Block, BGA
2 Peelable solder mask yes  
3 thickness ≥17um  
Silkscreen 1 Available colors white, black, yellow  
2 Min silkscreen line width 0.15mm  
Finishing 1 HASL 1-40um  
2 Lead-free HASL 1-40um  
3 Immersion gold over nickel Ni 3-5um Au 0.05-0.15um  
4 Flash gold    
5 OSP 0.2-0.5um  
6 Carbon ink printing    
7 Gold fingers (hard gold) Ni 5-10um Au 0.7-1.2um  
Tolerance 1 Outline tolerance ±0.125mm ±0.1mm
2 Hole diameter tolerance PTH ±0.075mm
NPTH ±0.05mm
 
3 Hole location tolerance ±0.1mm